摘要
结合新一代高压继电保护ARP-300系列装置的研制过程,介绍了高压继电保护装置核心CPU板的基本功能及其组成,提出了当前新技术条件下继电保护装置在硬件设计与开发过程中所面临的高速信号完整性问题。通过对核心CPU板上关键电路中关键信号的仿真与分析,阐述了关键信号的布线规则设置及实现方法。CPU板卡上具体信号的实际波形测试结果以及对继电保护装置系统性的电磁兼容试验结果表明,对核心CPU板在板级硬件设计阶段所进行必要的信号完整性分析与设计工作,对提高系统硬件研发的一次成功率、提高继电保护装置运行的稳定性和可靠性具有重要的作用。
The basic function and composition of kernel CPU board is introduced according to the design process of new generation high-voltage relay protection ARP-300 series.In new technical condition,the integrity problem of high-speed signal during the hardware design and development is presented.By simulating and analyzing the key signal of the key circuit,the corresponding wiring constraints and realization is explained in detail.Finally,the actual waveforms of kernel signal and the electromagnetic compatibility experiments of device indicate that during hardware design of kernel CPU board the signal integrity analysis improves the primary success rate of system hardware development and plays a very important role in enhancing working stability and reliability of relay protection devices.
出处
《江苏电机工程》
2012年第1期34-38,共5页
Jiangsu Electrical Engineering
基金
南瑞集团科技资助项目(JT09001-JB)
关键词
信号完整性
分析与设计
高速信号
高压继电保护
可靠性
signal integrity
analysis and design
high-speed signal
high-voltage relay protection
reliability
