树脂粘结剂对银汞合金充填微渗漏的影响

Study of the microleakage on bonding resin for amalgam filling.

目的 研究树脂粘结技术对银汞合金充填时微渗漏的影响。方法 以常规银汞合金充填作对照，对应用粘结剂后再完成的银汞合金充填进行了微渗漏试验和扫描电镜观察。结果 用粘结剂组粘结剂与窝洞壁、粘结剂与银汞合金均有良好粘结。对照组合金与洞壁间可见明显间隙。结论 应用树脂粘结剂可增加充填体与洞壁密合度，明显减少银汞合金充填微渗漏。

Objective To study the microleakage of amalgam filling with bonding resin. Method The dye infiltration test and SEM were used to check the microleakage and the gap between amalgam and cavity wall. Result The difference of dye infiltration between the adhesive group and control group was statistically significant. SEM showed that the bonding resin can adhere tightly to the cavity wall and amalgam. Conclusion Bonding resin could distinctly reduce microleakage and assure good adaptation between the cavity wall and amalgam.