摘要
通过对回流焊接工艺参数传输带速度、各个炉区温度设定和焊膏熔化温度曲线的关系研究,建立了大尺寸PCB组件传热过程的数学模型。基于ANSYS平台,模拟了无铅焊料PCB组件在十温区回流焊接过程中的温度场,从而确定了合适的焊接参数。
Build large-size PCB assembly mathematical model of heat transfer process through studying the relationships between the reflow soldering process parameters,such as conveyor speed,setting zone temperature of each furnace,and the melting temperature curve of paste.Simulate the temperature field of lead-free solder in the ten-zone reflow soldering of PCB assembly based on ANSYS-platform to determine the proper soldering parameters.
出处
《电子工艺技术》
2012年第1期10-13,49,共5页
Electronics Process Technology
基金
国家自然科学基金项目(项目编号:51075335)
西安市科协基金项目(项目编号:xkx05)
关键词
PCB
回流焊
温度场
无铅焊料
PCB
Reflow soldering
Temperature field
Lead-free solder
