摘要
随着芯片集成密度的增加,对封装可靠性的要求也越来越高,而芯片与基板上的颗粒污染物和氧化物是导致封装中引线键合失效的主要因素。故有利于环保、清洗均匀性好和具有三维处理能力的等离子清洗工艺技术成为了微电子封装中首选方式。介绍了等离子清洗工艺的基本原理,通过不同材质构成的混合集成电路的清洗实验,探讨了等离子清洗对引线键合工艺的影响,论证了等离子清洗工艺是提高产品键合质量可靠性的一种有效手段。
As chip density increasing,the reliability requirements are also getting higher and higher.Particle Contamination and oxide on the chip and the substrate are the main factors of resulting failure for wire bonding.So plasma cleaning technology has become the preferred way in microelectronics packaging.Introduce the basic principle of plasma cleaning technology.Study the effect of plasma cleaning on wire bonding process based on the cleaning experiment of hybrid integrated circuit composed of different materials.Demonstrate that plasma cleaning process is an effective means to improve quality and reliability of bonding product.
出处
《电子工艺技术》
2012年第1期26-30,共5页
Electronics Process Technology
