摘要
无铅焊接技术已经广泛应用于消费类和通讯类电子产品中,但由于其发展时间较短,可靠性仍需进一步研究验证。军工企业出于可靠性的考虑仍旧采用有铅技术,但在实际生产中,不可避免地遇到越来越多的无铅器件。如何在采用有铅制程的情况下焊接无铅器件并保证其可靠性已成为军工单位迫切需要解决的问题。围绕混装工艺的可靠性,详细介绍适用于军工单位的有铅工艺制程焊接无铅元器件的工艺方法和可靠性分析,最终结合工作实际给出较为完整的应对策略。
Lead-free soldering technology has been widely used in consumer,communications electronics products,but the reliability still needs to verify further because of its shorter used time.Military enterprises still takes the lead technology for reliability considerations,but the more and more lead-free devices are used inevitably in production.It has become an urgent problem needed to be solved how to solder lead-free device in lead process and assure its reliability.Introduce the soldering method and reliability analysis for lead-free components based on the mixing process reliability in detail,give a complete strategy according to practice.
出处
《电子工艺技术》
2012年第1期31-33,56,共4页
Electronics Process Technology
关键词
无铅器件
混合焊点
可靠性
Pb-free devices
mixed solder join
reliability
