摘要
阐述了塑封IC(集成电路)常见的失效现象,对塑封IC失效的几种分析方法和分析技术做了叙述,然后提出塑封IC失效分析的步骤,并从设计、工艺和材料控制、包装、运输等方面提出改善塑封IC可靠性的措施。
Described the failure of plastic IC common phenomenon in detail several of Plastic IC failure analysis methods and analysis techniques do narrative,and then put forward the steps Plastic IC failure analysis and design,process and material control,transportation and other aspects of the box measures to improve the reliability of plastic IC.
出处
《电子工业专用设备》
2012年第1期27-32,共6页
Equipment for Electronic Products Manufacturing
关键词
塑封IC
失效分析
改善措施
Plastic IC
Failure analysis
Improvement measures
