摘要
Bi layer formation in Cu/Sn-58Bi/Cu solder joints was investigated with different current densities and solder thickness. Uniform and continuous Bi layers were formed at the anode interface which indicated that Bi was the main diffusing species migrating from the cathode to the anode. The electromigration force and Joule heating took on the main driving forces for Bi diffusion and migration. In addition, two appearance types of Bi layers, planar-type and groove-type, were found during current stressing. The morphology and thickness of Bi layers were affected by current density and current stressing time.
Bi layer formation in Cu/Sn-58Bi/Cu solder joints was investigated with different current densities and solder thickness. Uniform and continuous Bi layers were formed at the anode interface which indicated that Bi was the main diffusing species migrating from the cathode to the anode. The electromigration force and Joule heating took on the main driving forces for Bi diffusion and migration. In addition, two appearance types of Bi layers, planar-type and groove-type, were found during current stressing. The morphology and thickness of Bi layers were affected by current density and current stressing time.
基金
supported by the China Postdoctoral Science Foundation (No. 20100480250)
the Beijing Natural Science Foundation Program and Scientific Research Key Program of Beijing Municipal Commission of Education(No. KZ200910005004)
