新型低残留波峰焊助焊剂的研究

Study on Low-residual Wave-soldering Flux

通过对多种原料的扩散性、浸润性、活性和安全性进行研究,筛选出合适的主成分、浸润剂、活性剂和溶剂,制备出一种新型低残留波峰焊助焊剂。探讨组分配比对波峰焊接后印制板焊盘、孔上铅锡的饱满度、腐蚀性以及残留量等的影响。结果表明,助焊剂的最佳组成为主成分3%,浸润剂2%,活性剂2%,其余为溶剂。该助焊剂活性高、助焊效果好、残留极少、无腐蚀,并且安全环保。

Though a study on diffusivity,wetting quality,activity and Security of a variety of matuerials,selected a suitable principal component,wetting agents,active agent and solvents,prepared a new low-residual wave-soldering flux.The effect of various component amount on PCB bonding pads which were treated by wave-solder,the brightness and fullness of lead-tin solder in hole,corrosive and residual were studied.The result showed that the best composition of soldering fluid were principal component agent was 3 %,wetting agents was 2 %,active agent was 2 %,the rest is solvent.The flux had high-activity,good-solderability,low-residual,non-corrosive,security and environmental protection.