摘要
在晶体薄片的双面抛光加工中,实现抛光压力的精确、多模式控制对获得晶片高平面度和无损伤、超平滑的加工质量至关重要。为此,提出了一种基于步进电机的压力加载系统。在简述压力加载系统组成及原理的基础上,对该压力加载系统进行了整体数学建模,并通过Simulink对系统性能进行了仿真分析;最后对石英晶片进行了加工实验。实验结果初步验证了所设计的抛光压力加载系统可以较好地实现抛光压力的动态加载及平稳保持,并获得了平滑的晶片抛光表面。
In order to realize the precise,multi-mode control of polishing pressure for getting a high planeness and no damaging super- smooth surfaces in wafer＇s double-sided polishing processing, a polishing pressure loading system which based on stepping motor was put forward. After the analysis of system% composition and principle,the mathematical modeling was established. A method of simulation in Simulink was presented to analyze its performance. The real control effects of polishing pressure were evaluated on the processing experiment of quartz wafer,the accuracy and stability of the polishing pressure loading system were tested. The experimental results show that the pressure loading system based on stepping motor is feasible and it can get a smooth polishing surface of wafers in polishing processing.
出处
《机电工程》
CAS
2012年第2期171-173,187,共4页
Journal of Mechanical & Electrical Engineering
基金
浙江省自然科学基金资助项目(Y108685)
浙江省科技计划资助项目(2009C31019)
关键词
步进电机
压力加载
数学建模
stepping motor
pressure loading
mathematical modeling
