摘要
在多层印刷电路板(PCB)设计时,经常需要信号通过过孔跨接到其他层走线,这种走线方式会导致返回路径不连续(RPD),引发信号完整性问题,文中应用电磁场全波仿真工具SIwave构建信号跨层走线模型,从电源分配网络(PDN)阻抗的角度分析了跨层走线对信号传输的影响,同时使用添加电容的方法优化信号传输路径,并对电容的选取及其位置的确定进行了研究,为PCB设计提供参考。
In multilayer printed circuit board（PCB） design,it＇s often needed to connect the signal from one layer to another through vias,which will arouse signal integrity issues.In this article,we build the signal cross-layer model by using full-wave electromagnetic field simulation tool SIwave,and then analyze its influence on signal transmission from the perspective of power distributed network（PDN） impedance.After that we adopt the method of adding capacitors to optimize the signal transmission path.We give detailed instructions on the selection of capacitance and determination of the location,which may serve as a reference of PCB design.
出处
《电子科技》
2012年第2期38-40,共3页
Electronic Science and Technology
