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RF thermal and new cold part design studies on a TTF-Ⅲ input coupler for Project-X 被引量:2

RF thermal and new cold part design studies on a TTF-Ⅲ input coupler for Project-X
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摘要 An RF power coupler is one of the key components in a superconducting (SC) linac. It provides RF power to the SC cavity and interconnects different temperature layers (1.8 K, 4.2 K, 70 K and 300 K). The TTF-Ⅲ coupler is one of the most promising candidates for the High Energy (HE) linac of Project X, but it cannot meet the average power requirements because of the relatively high temperature rise on the warm inner conductor, so some design modifications will be required. In this paper, we describe our simulation studies on the copper coating thickness on the warm inner conductor with RRR values of 10 and 100. Our purpose is to rebalance the dynamic and static loads, and finally lower the temperature rise along tbe warm inner conductor. In addition, to get stronger coupling, better power handling and less multipacting probability, one new cold part design was proposed using a 60 mm coaxial line; the corresponding multipacting simulation studies have also been investigated. An RF power coupler is one of the key components in a superconducting (SC) linac. It provides RF power to the SC cavity and interconnects different temperature layers (1.8 K, 4.2 K, 70 K and 300 K). The TTF-Ⅲ coupler is one of the most promising candidates for the High Energy (HE) linac of Project X, but it cannot meet the average power requirements because of the relatively high temperature rise on the warm inner conductor, so some design modifications will be required. In this paper, we describe our simulation studies on the copper coating thickness on the warm inner conductor with RRR values of 10 and 100. Our purpose is to rebalance the dynamic and static loads, and finally lower the temperature rise along tbe warm inner conductor. In addition, to get stronger coupling, better power handling and less multipacting probability, one new cold part design was proposed using a 60 mm coaxial line; the corresponding multipacting simulation studies have also been investigated.
作者 PEI Shi-Lun Chris E Adolphsen LI Zeng-Hai Nikolay A Solyak Ivan V Gonin 裴士伦;Chris E Adolphsen;李增海;Nikolay A Solyak;Ivan V Gonin(Institute of High Energy Physics,Chinese Academy of Sciences,Beijing 100049,China;SLAC National Accelerator Laboratory,Menlo Park,California 94025,USA;Fermi National Accelerator Laboratory,Batavia 60510,Illinois,USA)
出处 《Chinese Physics C》 SCIE CAS CSCD 2012年第2期173-178,共6页 中国物理C(英文版)
关键词 RF thermal effect TTF-Ⅲ input coupler multipacting dynamic RF power loss static thermal loss RF thermal effect, TTF-Ⅲ input coupler, multipacting, dynamic RF power loss, static thermal loss
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