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中温化学镀镍工艺及添加剂的研究 被引量:6

Study of electroless nickel plating process and its additive at medium temperature
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摘要 鉴于目前化学镀镍工艺存在的镀液温度高、能耗大及稳定性差等缺点,提出了一种中温化学镀镍工艺。在正交试验结果的基础上,采用三种添加剂组合使用,分别研究了络合剂、组合添加剂、温度及pH值对镀层沉积速度的影响。结果表明:采用组合添加剂能明显提高镀液的稳定性及沉积速度。 In view of the weaknesses of traditional electroless nickel plating process such as high bath temperature, large energy loss and poor bath stability. An electroless nickel plating process at medium temperature was advanced, combined additive consisting of three additives was adopted. Effects of complexing agent, combined additive, temperature and pH value on deposition rate were studied on the basis of orthogonal tests. The results show that electroless nickel plating process is greatly improved in bath stability and deposition rate by adopting combined additive.
出处 《电镀与涂饰》 CAS CSCD 2000年第1期39-42,共4页 Electroplating & Finishing
关键词 化学镀镍 中温 电镀 镀镍 工艺 助剂 electroless nickel plating medium temperature
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  • 1孙大梁(译),镀镍和镀铬新技术,1990年
  • 2方景礼.日本化学镀发展概况[J]电镀与环保,1986(03).

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