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AlF_3-KF-KBr钎剂去膜机理研究 被引量:3

Mechanism of oxide film removing with solder AlF_3-KF-KBr
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摘要 AlF3-KF-KBr钎剂是一种新型的低熔点、无腐蚀钎剂,可用于低熔点铝合金的钎焊.通过X衍射分析研究AlF3-KF-KBr钎剂去除纯铝表面氧化膜的机理.研究表明:AlF3-KF-KBr钎剂使纯铝表面的Al2O3氧化膜松动、破碎,并与其发生化学反应使膜彻底破坏,钎剂与氧化膜反应后生成KAl5O8和Al5O7Br,氧化膜的去除主要是溶解过程.此外还发现,AlF3-KF钎剂去除氧化膜主要是K3AlF6与Al2O3发生反应,KAlF4不与其发生反应,但能确保钎剂的流动性. AlF3-KF-KBr is a new solder with low melting temperature and without corrosion that can be used to braze low melting aluminum alloy.The Mechanism of oxide film removing from the surface if pure aluminum with solder AlF3-KF-KBr was investigated with X-ray diffraction method.It was found by investigation that the solder AlF3-KF-KBr was able to loosen or break the oxide film,and its chemical reaction with the film played an important role in the course of the removal.The reaction resultants were KAl5O8 and Al5O7Br.It was the key step that the dissolving caused the removal.It was also found that the reaction of K3AlF6 with Al2O3 played a main role to remove the oxide film.The KAlF4 did not react with Al2O3 but ensured the mobility of the solder.
出处 《兰州理工大学学报》 CAS 北大核心 2012年第1期9-11,共3页 Journal of Lanzhou University of Technology
基金 甘肃省科技支撑计划(090GKCA042)
关键词 AlF3-KF-KBr钎剂 氧化膜 X衍射分析 solder AlF3-KF-KBr oxide film X-ray diffraction
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