摘要
系统地介绍了液晶聚合物(LCP)薄膜材料的特性,同时介绍了LCP覆铜板的3种生产方法,分析了作为基板材料与其他传统基板材料的优势,综述了近年来LCP薄膜作为微波和毫米波材料在系统级封装中的研究进展,并指出LCP薄膜是一种具有巨大发展潜力的高频电子封装材料。
The characteristics of main producing methods are addressed liquid crystal polymer （LCP） systematically are disussed. Meanwhile, three and superiority is discussed compared with the other conventional packaging substrates. Finally, the recent research progress of LCP film in system-in-package as microwave and millimeter materials, which is regarded as future substrate and packaging material, is also reviewed.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2012年第3期15-19,共5页
Materials Reports
基金
国家自然科学基金(60876091)
关键词
液晶聚合物(LCP)
金属化
系统级封装
高频
liquid crystal polymer, metallization, system-in-package, high frequency
