摘要
以去离子水为溶剂、高沸点有机醇醚为助溶剂、有机酸为活化剂并使用复合表面活性剂研制成了一种无铅焊料用免清洗助焊剂,该助焊剂并含有一种天然的抗菌剂E以延长其保存期限。对该助焊剂的成分及配比进行了选择和优化,并对其性能进行了测试。结果表明,制备的免清洗助焊剂均匀透明,无刺激性气味,不含卤素,无腐蚀性,表面绝缘电阻大于1×108;将其用于SnAgCu系无铅焊料,焊接效果好,平均扩展率达到76.6%。
A kind of no-clean flux for lead-free solder was prepared. For the preparation of the flux, a kind of composite surfactant was used, while the deionized water, organic alcohol/ether with high boiling point and organic acids were employed as the solvent, auxiliary solvent and active agent, respectively. A kind of natural antibacterial agent E was also added to extend the shelf life of the flux. The components were selected, the composition was optimized, and the properties was studied for the flux. The results show that the flux is transparent, homogeneous, pungent-smell and halogen free and non-corrosive, and shows a surface insulation resistance above 10^8Ω. When the flux is used for lead-free SnAgCu solder, an excellent soldering performance and an average expansion rate of 76.6% are reached.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2012年第3期53-56,共4页
Electronic Components And Materials
关键词
助焊剂
免清洗
焊接性能
抗菌剂
flux
no-clean
soldering performance
antibacterial agent
