摘要
分布电容是多次级高压变压器固有的寄生参数,它直接影响电路的工作性能。本文从分布电容的产生机理出发,通过传统绕制和PCB迭绕两种工艺的比较,最后以实测波形来说明了分布电容对电路性能的影响。
The distributed capacitance is inherent in the multi-level high-voltage transformer parasitic parameters, which directly affects the circuit performance. According to the generation mechanism of distributed capacitance, through comparing the traditional method of winding and the technology of PCB Diego around, the measured waveform is used to illustrate the influence of distributed capacitance on circuit performance.
出处
《物联网技术》
2012年第2期36-38,共3页
Internet of things technologies
关键词
分布电容
多次级高压变压器
传统绕制
PCB迭绕
distributed capacitance
multi-level high-voltage transformer
traditional winding
PCB Diego around
