环形电镀金刚石线锯研究

Study of endless electroplated diamond wire saw

环形电镀金刚石线锯是将金刚石磨粒固着于环形钢丝基体上的一种切割工具。使用自制的环形电镀金刚石线锯进行多晶硅的切割试验,阐述了钢丝基体材料的选择,焊接方法,环形电镀金刚石线锯的制作工艺。采用切割工艺参数为:锯丝线速度20～40 m/s,工件进给速度2～10 mm/min,锯丝张紧力60～100 N。试验表明:硅片表面平整光滑,表面粗糙度Ra达到0.328～0.562μm,体现出环形金刚石线锯切割的良好特性。

Endless electroplated diamond wire is a kind of cutting tool with the diamond grits fixed on the steel wire substrate. The material selection of steel wire substrate, welding method, and the production process of endless eleetroplated diamond wire saw were expounded. The slicing experiment on polysilicon was carried out by using self-made endless eleetroplated diamond wire saw, the cutting processing parameters were wire saw speed 20 -40 m/s, workpiece feed speed 2 - 10 mm/min and wire saw tension 60 - 100 N. The experiment results showed that the endless electroplated diamond wire saw had good performance. The sliced silicon wafer had excellent surface quality and low surface roughness R, of 0. 328 - 0. 562μm.