无溶剂型双组分有机硅改性PU胶粘剂的制备与性能研究

Study on preparation and properties of solvent-free two-components PU adhesive modified by organic-silicone

以聚醚二元醇(DL-1000)、4,4′-二苯基甲烷二异氰酸酯(MDI)为主要原料合成端-NCO基PU(聚氨酯)预聚体;然后以γ-氨丙基三乙氧基硅烷(KH-550)对其进行嵌段共聚改性,并以3,3′-二氯-4,4′-二氨基二苯基甲烷(MOCA)/蓖麻油作为复合固化剂,制备出无溶剂型双组分有机硅改性PU胶粘剂。研究结果表明:硅烷键已引入PU胶粘剂中;随着KH-550含量的不断增加,胶粘剂的黏度增大、固化时间缩短、室温剪切强度下降且耐热性增强;通过调节不同KH-550含量,可制备出不同性能要求的胶粘剂;该胶粘剂的玻璃化转变温度(-45.9℃)相对较低,说明其耐寒性相对较好。

With polyether diol （DL- 1000）, MDI （4,4＇-diphenyl methane diisocyanate） as main raw materials, a PU（polyurethane） prepolymer with -NCO-terminal group was prepared. Then a solvent-free two-components PU adhesive modified by organic-silicone was made with KH-550 as modifier of block copolymer and MOCA/castor oil as composite curing agent. The research results showed that the silane-bond was introduced into PU adhesives. The adhesives with different properties requirements could be made by regulating different KH-550 contents because the viscosity and thermal stability of adhesive were increased ,but the curing time and shear strength at room temperature of adhesive were decreased with increasing KH-550 contents. The adhesive had reversely better cold resistance because its glass transition temperature（-45.9 ℃） was reversely lower.