几种最新加工微阵列方法的比较

Comparison among Several Latest Methods of Processing Microarray

分别介绍了使用LIGA技术、微细电火花线切割技术(μ-WEDM)、微磨技术、组合式加工技术加工微阵列的最新方法。使用移动LIGA技术加工微针阵列、微细电火花技术加工复杂的三维微阵列电极、微磨技术加工微锥塔阵列、和UV-LIGA技术与微细电火花技术组合加工微阵列电极的工艺方法。主要论述各种方法加工高深宽比阵列结构的原理及其优缺点以及加工中的效率、成本等问题。

This paper describes the latest processing methods in which the LIGA technology, μ-WEDM technology, micro-milling technology, combined processing technology are used. For example, the mobile LIGA technology is used to process microneedles, the μ-WEDM technology to process complex three-dimensional microelectrode array, the micro-milling technology to process micro pyramid-structured surface and UV-LIGA and micro EDM both technologies to process micro-electrode array. It also discusses the principle,advantages and disadvantages, processing efficiency, cost and others of the fabrication of compliant high aspect ratio microelectrode arrays.