采用Minitab软件优化印刷线路板电镀盲孔的参数

Parameter optimization for plating blind holes on printed circuit board by Minitab software

利用Minitab软件的田口设计方法对印刷线路板盲孔镀铜的工艺参数进行优化，镀液成分为：Cu2＋ 30～45g／L，H2SO4180～260g／L，C160～80mg／L，光亮剂8～15mL／L。得出盲孔孔径及4个镀铜缸喷压的最佳值。在最佳条件下，铜厚和凹陷值均符合要求，从而省却了填孔后的减铜工序，降低了成本，缩短了生产周期。

The process parameters for plating blind holes on printed circuit boards were optimized with Minitab software by Taguchi design method. The copper plating bath is composed of Cu2＋ 30-45 g/L, H2SO4 180-260 g/L, Cl- 60-80 mg/L, and brightening agent 8-15 mL/L. The optima of blind hole diameter and the spray pressure of four copper plating tanks were determined. The copper thickness and dimple value are qualified under the optimal conditions. Consequently, the copper thinning procedure after blind hole filling is omitted, resulting in lowered cost and shortened production cycle.