复合材料层合板的非同步固化翘曲变形分析

Analysis of Warpage Deformation of Composite Laminates Caused by Non-Synchronous Curing

复合材料层合板在实际固化过程中因板内温度梯度的存在 ,各铺层内树脂的固化反应并非同步进行。这种非同步过程导致层合板内固化后残余应力的分布不同于经典分析方法的计算结果 ,使按对称铺层设计的层合板亦存在固化后翘曲变形。针对实际固化过程的非同步特征 ,文中给出一种基于弹性子叠层块的非同步固化过程描述模型 ,用此模型对非同步固化过程引起的对称层合板翘曲变形进行计算机模拟 ,分析树脂固化收缩率 ,固化过程中板内温度梯度 ,以及层合板铺叠方式对非同步固化翘曲变形的影响作用 。

During cure of composite laminates, the reaction processes of different layers are practically not synchronous because of the nonzero temperature gradients in the laminates. Owing to non synchronous process, the residual stress distribution is different from the analytical result obtained by classical methodology and warpage can occur after cure even if the laminate is symmetrically designed. In view of the non synchronous characte ristic of real curing process, a model based on elastic sub laminate is proposed to describe non synchronous curing process. Simulation analyses of warpage deformation caused by non synchronous curing process are made, and the manners of influence of resin shrinkage, temperature gradient, and stacking sequence on warpage deformation are given.