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TC4/SiC扩散焊接工艺研究 被引量:3

Study on TC4/SiC Diffusion Bonding Technology
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摘要 陶瓷/ 金属连接构成的复合构件作为结构材料可以获得金属、陶瓷的性能互补,并降低复合材料的成本。本课题依据固相压力扩散焊接机理及特点,进行钛合金(Ti- 6Al- 4V) 和碳化硅陶瓷(SiC) 的扩散焊接工艺研究,并取得了初步结果。 Whereas the use of ceramic/metal complex as structure material further results in complementarity of the both materials as well as reduces composite manufacturing cost. Based on mechanisms and features of the diffusion bonding, this article studies the diffusion bonding technology for alloy(TC4) and ceramic(SiC). The research has already obtained preliminary results.
出处 《航空制造技术》 EI 2000年第1期22-23,46,共3页 Aeronautical Manufacturing Technology
关键词 扩散焊接 碳化硅陶瓷 钛合金 航天器 Diffusing bonding Carbolon ceramic Titanium alloy
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