5Jeong-Won Yoon,Seung-Boo Jung.Effect of immersion Ag surface finish on interfacial reaction and mechanical reliability of Sn-3.5Ag-0.7Cu solder joint[J].Journal of Alloys and Compounds2008(458):200-207.
6K Zeng.,K N Tu.Six cases of reliability study of pbfree solder joint in electronic packaging technology[J].Mater Sci Eng,2002,38:55-105.
7Frank W.Gayle,Gary Becka,Jerry Badgett.High temperature lead-free solder for microelectronics[J].J Electron Mater,2001(6):17-21.
8H.Gan,W.J.Choi,G..Xu,and K.N.Tu.Electromigration in solder joints and solder lines[J].J Electron Mater,2002(6):34-37.