聚甲基苯基硅氧烷改性双酚F环氧树脂及其粘接性能的研究

Study on the Synthesis and Adhesive Properties of Polymethylphenylsiloxanes Modified Bisphenol-F Epoxy Resins

羟基封端聚甲基苯基硅氧烷与双酚F环氧树脂进行接枝聚合反应制备了有机硅改性环氧树脂,研究了催化剂、反应温度、反应时间对产物的影响.最佳反应条件是:催化剂为三苯基膦,反应温度为120～150℃,反应时间为7～9h.讨论了聚甲基苯基硅氧烷含量对改性环氧树脂粘结性能的影响.研究结果显示,改性环氧树脂耐高温粘接性能较双酚F环氧树脂明显提高,当聚甲基苯基硅氧烷与双酚F环氧树脂质量配比为1∶4时,制备的改性环氧树脂固化物经300℃12h后剪切强度仍可达到5.4 MPa,适于用作耐高温胶粘剂.并采用FT-IR、TGA等手段对产物进行了表征.

The organosilicon modified epoxy resins were prepared by grafted polymerization of OH-terminated polymethylphenylsiloxanes （HO-PMPS） and Bisphenol-F Epoxy Resins. The influences of catalysts, reaction temperature and time on polymerization were discussed. The optimal reaction conditions are that the catalyst is Ph3P, reaction temperature is from 120 ℃ to 150 ℃, reaction time is from 7 h to 9 h. The influences of the ratio of polymethylsiloxanes on adhesive properties of modified epoxy resins were also dicussed. The results show that the heat-resistance adhesive properties of modified epoxy resins significantly improved. The sample prepared from 1 ： 4 mass ratio of OH-PMPS to epoxy resin has its shear strength as high as 5.4 MPa after heat aging at 300 ℃ for 12 h. Modified epoxy resins were characterized by means of FT-IR and TGA.