化学机械研磨废水处理及回用技术的研究进展

Progress on Treatment and Reuse Technologies of Chemical Mechanical Polishing(CMP) Wastewater

化学机械研磨废水产生量大但总体污染物浓度不高,回用潜力巨大,其处理及回用技术是芯片制造企业的研究重点。文章介绍了化学机械研磨废水来源、水质特征,概述并对比分析了常用的化学机械研磨废水处理和回用技术及其应用现状和发展趋势,并指出以膜滤或电化学处理为主的处理及回用技术具有良好的运用前景。

A large volume of chemical mechanical polishing （CMP） wastewater has been generated each year, however the pollutant concentration in CMP wastewater is not so high that it has considerable potential of reuse. The treatment and reuse technologies of CMP wastewater is becoming a focus of wafer fabrication industry. Sources and characters concerning CMP wastewater was introduced, the conventional treatment and reuse technologies of CMP wastewater as well as its present application status and development trend were analyzed. Ultrafiltration and electrochemical treatment process would become the dominant way of CMP treatment and reuse.