深亚微米器件沟道长度对总剂量辐照效应的影响

The influence of channel length on total ionizing dose effect in deep submicron technologies

研究了180 nm互补金属氧化物半导体技术下的器件沟道长度对总剂量辐照效应的影响.在其他条件如辐照偏置、器件结构等不变的情况下,氧化层中的陷阱电荷决定了辐照响应.浅沟槽隔离氧化层中的陷阱电荷使得寄生的侧壁沟道反型,从而形成大的关态泄漏电流.这个电流与沟道长度存在一定的关系,沟道长度越短,泄漏电流越大.首次发现辐照会增强这个电流的沟道长度调制效应,从而使得器件进一步退化.

The influence of channel length on total ionizing dose effect in a 180 nm complementary metal-oxide semiconductor technology is studied. When other conditions such as radiation bias, device structure are the same, the overall radiation response is determined by the charges trapped in the oxide. The off-state leakage due to the charges trapped in the shallow trench isolation oxide inverting the parasitic sidewall channel has correlation with the channel length. A shorter channel leads to a larger leakage current. For the first time, we report that the leakage current also exhibits the radiation enhanced channel-length modulation effect, which further degrades the device performance.