集成电路电极布线用铝合金薄膜及其溅射靶材

Aluminum Alloy Films and Sputtering Targets for Semiconductor Integrated Circuit Wiring and Electrodes

近年来 ,铝合金薄膜广泛用作半导体集成电路的电极布线材料。作为制备溅射薄膜材料的铝合金靶材也获得了相应的应用。本文介绍了集成电路电极布线用铝合金薄膜及其溅射靶材的种类和性能 ,铝合金靶材的制备工艺以及铝合金靶材的发展趋势。

In recent years,aluminum alloy films have been employed for electrodes and wiring of integrated circuit (IC).As a material used to prepare sputtering films,aluminum alloy targets have been widely used.This paper introduced the properties of a few kinds of aluminum alloy films and sputtering targets for preparation of electrodes and wiring of IC.The preparation of aluminum alloy targets and their development trend were also reported.