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Sn-Zn-Cu-Al无铅钎料的组织及性能分析 被引量:6

Organization and Performance Research of Sn-Zn-Cu-Al of Lead-free Solder
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摘要 以Sn-9Zn-2Cu为研究对象,采用合金化的方法考察不同含量的Al元素对其微观组织及性能的影响。发现Al元素的加入可以较大地提高钎料的润湿性和抗氧化性。当w(Al)为0.035%时,钎料润湿性最好,同时钎料的硬度最大;当w(Al)为0.01%时,钎料抗氧化性最佳;Al元素的加入稍微提高了合金的熔点,主要集中在203℃左右;Al元素可以使合金组织细化,减小第二相尺寸,使其分散均匀化。 This article takes Sn-9Zn-2Cu as the object of study, inspecting A1 element of different contents to its microscopic organization and the performance influence using the alloy method. The re- search discovered that the A1 element may enhance the wettability and oxidation resistance of lead-free solders. When w(Al) is 0.035% , the wettability of solder is the best, and simultaneously the hard- ness is also the biggest; when w(Al) is 0.01%, the oxidation resistance is the best; the Al element also enhances the melting point of alloy slightly, mainly concentrated in about 203 ℃ ; the Al element may cause the alloy organization refinement, reduce the second size, and cause its disperser uniformization.
出处 《重庆理工大学学报(自然科学)》 CAS 2012年第2期64-70,共7页 Journal of Chongqing University of Technology:Natural Science
关键词 合金化 润湿性 抗氧化性 微观组织 alloy wettability oxidation resistance microscopic organization
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