柔性OLED器件薄膜封装研究

Study on Thin Film Encapsulation for Flexible OLED Packaging

把有机发光二极管(OLED)制备在柔性基底上,以此来实现柔性显示是未来显示技术发展的一个重要方向。但柔性基底相对于玻璃基底来说对水、氧气的阻挡能力较弱。为了延长柔性OLED器件寿命,就需要在柔性基底上进行有效的封装。文章首先介绍了柔性OLED的器件结构和常规的封装方法,然后重点介绍了目前比较热门的Barix封装技术以及ALD技术,这两种技术都能够对器件进行有效的封装,将薄膜阻挡层的水汽渗透率降到一个较低的范围内,能够满足OLED在柔性显示和发光方面的需要,但是在效率和成本方面仍然需要进一步的改善。

It is a promising direction of novel display technology to fabricate OLED on flexible substrate. But it is too weak for flexible substrate against water and oxygen. In order to extend the life time of flexible OLED, effective package is needed. This paper firstly describes the structure of flexible OLED devices and ,2 conventional thin-film encapsulation methods, then focuses on Barix encapsulation technology and ALD technology. Both technologies are effectively package methods, the water vapor transmission rate（WVTR） can be reduced to a low level to meet the requirement of flexible OLED display. However, improvement should be done to increase the efficiency and lower the cost.