集成电路引线冲切成形技术研究

Punching forming technology of IC leading wire

介绍了集成电路封装形式的演变过程,总结了表面贴装类产品在传统成形工艺下产生的缺陷,并提出了一种新的集成电路冲切成形结构,此结构的优点是减小了条料与成形零件的接触面,产品成形后对多余的引线脚采用整体切断,改善了产品的外观,减小了引线脚的擦伤,控制了产品的成形尺寸及平面度。

The evolution process of integrated circuit packaging forms was presented and defects in surface-labeling products with traditional forming process were reviewed. A new punching forming structure for IC was proposed in which the interface area between bar stocks and formed parts was reduced. Besides, the redundant leading wire feet were wholly cut off after the products were formed. As a result, the products appearance was improved and the leading wire feet abrasion were decreased. The forming dimensions and flatness were controlled as well.