磁控溅射技术制备硅纳米晶多层膜及微观结构表征

The microstructure of Si nanocrystallines multilayers deposited by magnetron sputtering

在室温下,分别利用常规磁控溅射和反应磁控溅射技术交替沉积Si薄膜和Si1-xNx薄膜在单晶硅基体上制备了Si/Si1-xNx纳米多层膜。接下来,在高温下对Si/Si1-xNx多层膜进行退火诱发各层中形成硅纳米晶。研究了Si1-xNx层厚度和N2流量沉积对Si/Si1-xNx多层膜中Si量子点形成的影响。TEM检测结果表明,N2流量为2.5mL/min时沉积的多层膜退火后形成了尺寸为20～30nm的等轴Si3N4纳米晶;N2流量为5.0mL/min时沉积的多层膜退火后在Si层和Si1-xNx多层中均形成了硅纳米晶,而在7.5mL/min N2流量下沉积的Si/Si1-xNx多层膜退火后仅在Si层中形成了硅纳米晶。

Abstract： Si1-xNx multilayers were grown by alternating deposition of Si layer and Si1-xNx layer using magnetron sputtering and reactive magnetron sputtering under different N2 flows, and the post-deposition annealing of Si/Si1-xNx multilayers is performed. Transmission electron microscopy （TEM） was used to characterize the microstructure of muhilayers. The cross-sectional TEM reveales that the formation of Si3 N4 nanocrystallines for 2.5mL/min N2 flows and Si nanocrystallines are embedded in Si layers and Si1-xNx layers of muftilayers deposited under 5.0mL/min N2 flows and in Si layers of multilayers deposit at 7.5mL/min N2 flows.