摘要
该文介绍了触摸屏热压区可靠性设计分析,从选材、结构设计、工艺等方面进行了全面的阐述,其中重点分析了输出端子FPC的选材、热压区域设计结构、异方性导电胶ACP机理及操作要求。
In this paper,we analysis the touch-panel heat-pressing reliability design including material,structure design,processing-method etc.We lay stress on analysis of FPC material,heat-pressing area structure design,the mechanisms of ACP and the require of processing.
出处
《电子质量》
2012年第3期26-29,共4页
Electronics Quality
关键词
触摸屏
热压
可靠性
FPC
touch-panel
heat-pressing
reliability
FPC
