摘要
介绍了X波段放大混频组件的研制情况。该组件由限幅器、低噪声放大器、镜像抑制混频器及中频放大器四部分组成。该组件具有噪声系数低、镜频抑制度高、输出功率1dB压缩点大、抗烧毁功率大等特点。
The design of the X - band subassembly was introduced in this paper. The subassembly was consist of limiter, low noise amplifier, image reject mixer and IF amplifier. The subassembly had the features of low noise figure, high image reject, high 1 dB compression point and high antibum power.
出处
《低温与超导》
CAS
CSCD
北大核心
2012年第3期78-80,共3页
Cryogenics and Superconductivity
