摘要
在晶圆双面及孔的侧壁用一种简单的工序电沉积金属的能力,在先进封装和某些工艺中提供了一些基本的优势。双面电镀样机硬件已经过用配置垂直电镀槽的生产型ECD装置的试验。这种工艺已经成功地在几种不同的金属和多种应用中得以展示。
The ability to electrodeposit metals on both sides of a wafer and on the sidewalls of vias in a single step offers some key advantages in advanced packaging and other processes. Prototype double-sided plating hardware has been tested in a production ECD tool with vertical plating cells. This process has been successfully demonstrated for several different metals and multiple applications.
出处
《电子工业专用设备》
2012年第3期17-19,共3页
Equipment for Electronic Products Manufacturing
关键词
3D封装
硅通孔
封装体叠层
倒装芯片
双面电镀
电镀
3D packaging, TSV, package-on-package, flip chip, double-sided plating, electroplating.
