Cu/SiC高能球磨后的形貌组织研究

Studies on the structural form Cu-SiC compounds by mechanical alloyin

讨论了Cu-SiC复合粉体球磨后的组织形貌,通过对球磨后Cu-SiC复合粉体进行扫描电镜和面分布分析确定了Cu对SiC的包裹以及SiC在Cu基体上的分布状态。实验结果表明:球磨20 h后,Cu对SiC颗粒有了较大程度的包裹且SiC颗粒弥散分布在Cu基体上,达到了增强基体的效果。

The structure and form of Cu-SiC compound powers during high energy ball-milling were mainly discussed in this article. SEM was used to analyse the milled Cu-SiC compound powers, which affected uniformity of SiC in the Cu bodys and enwrapped of SiC. The results of experiment showed that grains of SiC were enwrapped and uniformity was distributed in the basic body of Cu after 20 h milled.