期刊文献+

钒离子注入硅合成硅化钒薄层

Synthesis of thin layer V silicides by means of V implantation
下载PDF
导出
摘要 用大束流密度的钒金属离子注入硅 ,能够直接合成性能良好的薄层硅化物 随束流密度的增加 ,硅化钒相生长 ,薄层硅化物的方块电阻RS 明显下降 ,当束流密度为 2 5 μA/cm2 时 ,Rs 达到最小值 2 2Ω/□ ,说明连续的硅化物已经形成。X衍射分析表明 ,注入层中形成了V3 Si、V5 Si3 、V3 Si5 和VSi2 四种硅化钒。经过退火后 ,Rs 明显地下降 ,Rs 最小可降到 9Ω/□ ,电阻率可小到 72 μΩm ,说明硅化钒薄层质量得到了进一步的改善 ,大束流密度注入和退火后 ,硅化钒相进一步生长。大束流密度注入和高温退火 ( 1 2 0 0℃ )仍然具有很低的薄层电阻率 ,这充分说明硅化钒具很好的热稳定性。透射电子微镜观察表明 ,连续硅化钒薄层厚度为 80nm。 The good properties of V silicides were synthesized by using metal V ion implantation with large ion flux.It was found that the V silicides grown up and sheet resistance R s decreased with increasing ion flux.The R s minimum of 22Ω/□ was obtained when the ion flux of 25μA/cm 2 was used,which indicated that continuous layer of V silicides were formed.X?ray diffraction analysis shows that four kinds of V silicides of V 3Si,V 5Si 3,V 3Si 5 and VSi 2 were formed in V implanted silicon.The quality of the silicides was improved further after annealing.If the sample was annealed at 1050℃ for 20s,the R s decreased to 9Ω/□,the resistivity is 72μΩ.m.It can be seen from TEM observation that depth of continuous layer of V silicides is about 80nm.
出处 《微细加工技术》 EI 2000年第1期21-25,9,共6页 Microfabrication Technology
基金 国家自然科学基金!(596 710 51) 86 3计划的资助项目
关键词 离子注入 硅化物 硅化钒 薄膜 集成电路 V ion implantation silicon silicide synthesis rapid thermal annealing large ion flux
  • 相关文献

参考文献8

  • 1Marc-A Nicolet, Lau S S. Formation and characterization of transition metal silicides. In Einspruch N G, VLSI electronics microstructure science, New York: Acadernic Press,1983,16: 329-464
  • 2Li Wenzhi, Kheyrandish, Grant W A. Cr ion inradiation and thermaal annealing of Chromum film on silicon for fabrication of silicides. Nuclear Instrument and Methods, 1987,B19/20:723-730.
  • 3Mantl S, Ion beam synthesis of epitaxial silicides: fabrication, character and application, Materials Science and Report, 1992,8:1-95.
  • 4Zhang Tonghe, Wu Yuguang, Luo Yan. A new method of silicides formation by Ti and Y ion MEVVA implantation In: Proceedings of the 3rd inter. Conf.on solid state and integrated circuit technology,Beijing: Electronic Industry Press,1992; 113-115.
  • 5张通和,陈俊,孙贵如,吴瑜光,魏富忠,张荟星,张孝吉.强脉冲金属离子注入制备硅化物[J].高技术通讯,1993,3(9):1-6. 被引量:4
  • 6Zhang Tonghe, Chen Jun, Sun Guiru. The metal silicides formation by Ti, Y,Fe and W using MEWA implantation. Surface and Coatings Technology,1994,66:355-360.
  • 7LiuBX-JApplPhys,1994,75:847.
  • 8LiuBX-MaterialsChemistryandphysics,1998,54(1/3):309.

共引文献3

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部