高折光指数含硅环氧树脂的合成与性能研究

Synthesis and properties of silicon-containing epoxy resin with high refractive index

将二苯基二氯硅烷经过氢化铝锂还原为二苯基硅烷,再与4-乙烯基环氧环己烷进行硅氢加成后合成了1种新型含硅环氧树脂二[2-(3,4-环氧环己基)乙基]二苯基硅烷(EODPS)。该树脂的折光指数达到1.567,并具有较好的透明度。采用甲基六氢苯酐和乙酰丙酮铝-二苯基硅醇组合物分别对EODPS进行固化。通过红外光谱,DSC分析表征了EODPS的结构,研究了其固化活性,并对固化后产物的热稳定性、力学性能和吸水性进行了测试,且与脂环族环氧树脂CEL-2021P性能进行了比较。结果表明,与CEL-2021P相比,EODPS具有更高的热稳定性和更低的吸水率,可用于LED封装。

A new silicon-containing epoxy resin di[2-（3,4-epoxycyclohexylethyl）]diphenylsilane（EODPS） was synthesized by two reactions： first the diphenyldichlorosilane was reduced to diphenylsilane by lithium aluminum hydride and then the diphenylsilane was hydrosilylated with 1,2-epoxy-4-vinylcyclohexane.The refractive index of EODPS was up to 1.567 and the resin had good transparency.The methyhexahydrophthalic and aluminum acetylacetonate/diphenylsilandiol compound were used to cure EODPS.The structure of EODPS was characterized and its curing reactivity were investigated by FTIR and DSC.The thermal stability,mechanical properties and water absorption of the cured product were tested and compared with cycloaliphatic epoxy resin CEL-2021P.The results indicated that the cured EODPS had better thermal stability and lower water absorption and could be used for LED encapsulation.