SMT焊盘设计中的关键技术

Key Techniques for the Design of Bonding Pads in Surface Mount Technology

焊盘设计技术是表面组装技术(SMT)的关键。详细分析了焊盘图形设计中的关键技术,包括元器件选择的原则、矩形无源元件、SOIC和PLCC及QFP器件的焊盘优化设计。

The designing of bonding pads is the key in surface mount technology(SMT).Critical techniques including the principle of selecting elements and the optimal design of bonding pads in rectangular passive elements,SOICs ,PLCCs and QFPs,are described.Finally,problems associated with bonding pads in designing printed circuit boards are discussed.It provides reference for relevant designers.