摘要
研究了多元醇类溶剂及其复配物对Sn0.3Ag0.7Cu焊膏性能的影响。结果表明:四氢糠醇和聚丙二醇对冰白和水白松香都具有较强的溶解性。当四氢糠醇和聚丙二醇以质量比9:1复配时,获得的焊膏平均铺展率可达87%以上,焊点完整、饱满、无焊球和桥连等缺陷,储存时间较长,是一种综合性能良好的焊膏。
Study the effect of polyatomic alcohol and the mixed solvents on the performance of SnO.3AgO.7Cu lead-free solder paste. The results show that both tetrahydrofurfuryl alcohol and polypropylene glycol have high solvability to ice-white rosin and water-white rosin. When tetrahydrofurfuryl alcohol and polypropylene glycol compounded with the mass ratio of 9 ： 1 are used as solvent, get a kind of solder paste which has good combination property-over 87% spreading ratio, long storage time, integral and plump solder joint with no defect of solder ball and bridging, etc.
出处
《电子工艺技术》
2012年第2期71-74,105,共5页
Electronics Process Technology
基金
陕西省重点学科建设专项资金资助项目(项目编号:00x902)
