摘要
总结了无铅BGA返修的工艺特点、技术要求和温度曲线设置方法;介绍了一种暗红外返修系统的结构与性能特点;结合实际工作详细描述了某航天产品无铅BGA返修的实施工艺,重点阐述了返修时高可靠性的实现方法;从而验证了基于此设备的工艺方法对于无铅BGA返修的有效性。
Summarize the characteristics of lead-free BGA rework process, technical requirements and methods of setting temperature curve; describe the structure and performance characteristics of a IR rework system; combine with work experience, describe a product＇s implementation of lead-free BGA rework process in detail, which focuses on the repair methods of high reliability; Prove the effectiveness of the method based on this machine for lead-free BGA rework process.
出处
《电子工艺技术》
2012年第2期86-89,共4页
Electronics Process Technology
