碳纳米管互连的研究进展

Progress in research on carbon nanotubes interconnection

随着集成电路的不断发展,电路中互连线规模越来越大,尺寸越来越小,需要承受的电流密度越来越大。在这种趋势下,传统的铜互连线的有效性和可靠性都随之变差。由于碳纳米管具有良好的电学,热学和机械性能,使其成为目前研究较热的互连材料之一。本文概述了碳纳米管用于集成电路互连的优势,碳纳米管互连的电路模型,碳纳米管互连面临的挑战及其最新的研究进展,并展望了碳纳米管作为集成互连的研究前景。

As the development of the VLSI, the amount of the interconnection in the chip scaled up while its size scaled down, and the current density in the interconnection getting bigger and bigger. In this tendency, the validity and reliability of traditional copper interconnection get worse. Carbon nanotubes, which have small aspect ratio, small resistivity and can endure larger cmTent density, is a good candidate for the next interconnection. In this paper, we summarized the advantages of carbon nanotubes as inter- connect material, the progress in the simulation of electric performance of carbon nanotube interconnec- tion, the challenges of carbon nanotube to be used for interconnection and the countermeasures. In addi- tion, the perspect of the studies of carbon nanotubes interconnections is given briefly.