玉米应力裂纹的生成和扩展过程模拟

Simulation of Formation and Development of Stress Cracks in Corn

对玉米应力裂纹进行了分形分析 ,结果表明 ,玉米应力裂纹具有近似的自相似性 ,即分形特征 ,因此 ,可以用分形的理论进行研究。根据显微图像分析 ,认为分形形纹的扩展有 4种机制 ,即沿晶扩展、穿晶扩展、沿晶和穿晶偶合扩展及分叉扩展。建立了各种应力裂纹扩展机制的分形模型 ,给出了生成元维数 ,模拟了整个剖面和局部显微状态下应力裂纹的扩展过程。

Stress cracks are fine fissures in corn grain endosperm. In general, stress cracks are caused by rapid drying of corn grain at high temperatures. The fractal analysis on stress cracks in corn was carried out. The irregular and rough profile of stress cracks of corn can be regarded as having self similarity statistically, and be studied according to fractal theory. Four types of fractal propagating models of stress cracks were established, and its fractal dimensions were developed. The propagating process of the whole and partial sections was simulated.