微量In对Sn-0.3Ag-0.7Cu无铅钎料抗氧化性能的影响

Effect of Micro In-element on the Oxidation Resistance of Sn-0.3Ag-0.7Cu Lead-free Solder

微量In的添加能够提高Sn-0.3Ag-0.7Cu焊料的抗氧化性能。研究发现,In元素的加入可有效提高钎料的抗氧化能力。当钎料中In的质量分数为0.025%时,钎料的抗氧化性能与润湿性能均达到最佳。加In钎料的抗氧化有效温度范围是300℃以下。In元素会在合金中优先氧化,阻碍钎料的进一步氧化。

Addition of micro In-element may raise the oxidation resistance of Sn-0.3Ag-0.7Cu.The research results show that addition of micro In-element may improve the oxidation resistance of lead-free solder greatly.In the case the content of In-element is 0.025% in lead-free solder,both the oxidation resistance and wetting property present best performance.The anti-oxidation effect is available only when the temperature of solder is below 300 ℃.It is found that In-element can be oxidized preferentially in alloy,which consequently prevents solder from further oxidation.