空心玻璃微球隔热保温板的制备及其理化特性

Preparation and Physicochemical Properties of Hollow Glass Microspheres Thermal Insulation Board

将空心玻璃微球(hollow glass microspheres,HGM)与饱和硝酸铝溶液混合,经520℃保温30min热处理后制备出刚性保温板。测试了保温板的导热系数、抗压强度和燃烧性能,讨论了HGM粒子密度和平均粒径对保温板导热系数的影响。结果表明:保温板的导热系数随HGM粒子密度的下降而降低,当粒子的粒子密度为0.18 g/cm3时,保温板的导热系数为0.072 W/(m.K),抗压强度为2.2 MPa;当HGM的平均粒径小于30μm时,保温板的实测导热系数与Dul'nev提出的预测方程的计算结果相接近,HGM保温板的燃烧性能达到A1级不燃材料要求,可满足建筑保温和防火的要求。

The rigid insulation boards were heat–treated at 520 ℃ for 30 min by hollow glass microspheres（HGM） mixed with a saturated solution of aluminum nitrate.The thermal conductivity,compressive strength and combustion performance of insulation board were tested,and impacts of the particle density and average particle size of HGM on thermal conductivity of insulation board were discussed.The results show that the thermal conductivity of insulation board decreases with HGM to lower particle density.When the particle density of HGM is 0.18 g/cm3,the thermal conductivity of insulation board is 0.072 W/（m？K）,the compressive strength is 2.2 MPa.When the average particle size of HMG less than 30 μm,the measured thermal conductivity of the insulation board is close to that from calculation of Dul＇nev＇s prediction equations.HGM insulation board meets the requirements of building insulation and fire protection because its burning behavior meets the criterion of level A1.