期刊文献+

光诱导沉积技术的发展及其在光伏工业中的应用 被引量:3

Development of light-induced deposition and its application to photovoltaic industry
原文传递
导出
摘要 光诱导沉积技术因具有可以不用屏蔽或遮盖也能使金属离子在材料表面沉积出各种图案的优点,而成为微电子领域和光伏领域替代传统丝网印刷技术制备选择性图案或者使图案金属化的方法。本文回顾了光解型和光生电子型光诱导沉积技术的发展历程,指出了存在的问题。认为镀液稳定性研究,防扩散层与基体结合力的提高,镀层机械性能和电气性能的改善,以新的镀种取代贵金属,以及产品寿命的延长,是今后的发展方向。 Light-induced deposition process has the advantages of forming various patterns by metal deposition on the surface of materials without shielding or covering, which is a method for preparation of selective pattern and metallization technique in the field of microelectronics and photovoltaic industry to replace the traditional screen- printing process. In this article, the development history and current status ofphotolysis-type and photogenerated electron type light-induced deposition methods were reviewed, and the existing problems were pointed out. It is suggested that the research on bath stability, enhancement of the adhesion between diffusion barrier and substrate, improvement of the mechanical and electrical properties of deposit, new bath substitution for noble metal bath, and extension of product service life are the directions of development of light- induced deposition in the future.
出处 《电镀与涂饰》 CAS CSCD 北大核心 2012年第4期43-47,共5页 Electroplating & Finishing
关键词 光诱导沉积 光伏工业 电沉积 太阳能 微电子 light-induced deposition photovoltaic industry electrodeposition solar energy microelectronics
  • 相关文献

参考文献16

  • 1HALLIWELL M J,ZAHAVI J. Laser induced selective electroless plating[P].US,4681774,1987.
  • 2SCHLESINGER M,PAUNOVIC M. Modern electroplating[M].New York:John Wiley and Sons,Inc,2000.510-511.
  • 3ESROM H,KOGELSCHATZ U. Metal deposition with a windowless VUV excimer source[J].Applied Surface Science,1992.440-444.
  • 4ESROM H. Fast selective metal deposition on polymers by using IR and excimer VUV photons[J].Applied Surface Science,2000,(1/4):1-4.
  • 5CHEN D S,LU Q H,ZHAO Y. Laser-induced site-selective silver seeding on polyimide for electroless copper plating[J].Applied Surface Science,2006,(03):1573-1580.
  • 6SP(A)TH W. Verfahren zur galvanischen abscheidung einer metallschicht auf der oberfl(a)che eines halbleiterk(o)rpers[P].DE,2348182,1975.
  • 7METTE A,SCHETTER C,WISSEN D. Increasing the efficiency of screen-printed silicon solar cell by light-induced silver plating[A].Waikoloa:IEEE,2006.1056-1059.
  • 8WEFRINGHAUS E,PETRES R,HELFRICHT A. Electroless silver plating of screen printed front grid fingers as a tool for enhancement of solar cell efficiency[A].Milan:The Executive Committee of the EU PVSEC,2007.
  • 9GLUNZ S W,ALEMAN M,BARTSCH J. Progress in advanced metallization technology at Fraunhofer ISE[A].San Diego:IEEE,2008.
  • 10ALEM(A)N M,BAY N,BARUCHA D. Front-side metallization of silicon solar cells by nickel plating and light induced silver plating[J].Chemical Vapor Deposition,2009,(02):412-417.

同被引文献38

引证文献3

二级引证文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部