基于正交试验的光纤传感器金属化连接工艺优化

Optimization for metallization bonding technique of optical fiber sensor based on orthogonal test

为了克服光纤传感器有机胶封装带来的可靠性差、应变传递效率低的问题,采用粒子扩散系统对光纤传感器进行金属化连接以实现光纤传感器的无胶封装;为提高金属粘接层与基体的结合强度,设计了以工作距离、驱动电压、进给速度、粒子场气压为试验素的4水平正交试验方案,并用划痕法对金属粘接层的结合强度结果进行评估。通过统计分析,获得了影响金属粘接层与基体结合强度的主要因素和次要因素,优化了光纤传感器金属化连接工艺。

In order to solve the problem of low reliability and strain transmission efficiency of optical fiber sensor packaged with epoxy adhesive,a system for metallization bonding of optical fiber sensor based on particle diffusion mechanism is developed to research package technology of optical fiber sensor without epoxy adhesive.To improve bonding strength between metal bonding layer and substrate,orthogonal test scheme of four levels is designed with four factors which are working distance,driving voltage,feeding rate,air pressure of particle field and bonding strength is evaluated by scratch test.The primary and secondary factors which influence on the bonding strength of metal bonding layer and substrate are acquired by the method of statistical analysis and metallization bonding technique of optical fiber sensor is optimized.