电子束/潮气双重固化有机硅杂化环氧树脂的制备及性能研究

Synthesis and Properties of EB/Moisture Dual Curable Organosilicon Hybrid Epoxy Resin

以酚醛环氧树脂(F-51)、丙烯酸(AA)、γ-氨丙基三乙氧基硅烷(KH-550)及异氟尔酮二异氰酸酯(IPDI)为原料,制备了电子束/潮气双重固化有机硅杂化环氧树脂。采用傅里叶转换红外光谱法,对合成过程分子结构的变化进行表征,结果表明成功制备了预期产物。以此为预聚物,制备电子束/潮气双重固化涂层,并对涂层电子束/潮气双重固化工艺及固化后物理性能进行了研究。结果表明,电子束辐照适宜剂量为90kGy,经过潮气固化后,涂层铅笔硬度和摆杆硬度都有明显的提高,并且潮气固化时间随硅氧烷含量的降低而逐渐缩短。

A novel EB /moisture dual curable organosilicon hybrid epoxy resin was synthesized from bisphenol F type novolac epoxy resin（F-51）,acrylic acid（AA）,γ-aminoropyl triethoxysilane（KH-550） and isophorone diisocyanate（IPDI）.The expected product was characterized by Fourior-transform infrared spectroscopy（FT-IR）.The results indicated that the required product was successfully prepared.Then dual curable coatings were prepared with the hybrid resin as oligomer.The curing process and properties were investigated.The result showed that the optimum EB irradiation for the resins curing was 90kGy.In addition,the pencil hardness and pendulum hardness of film were obviously increased after moisture curing and the time of moisture curing was shortened with the decrease of trimethoxysilane end groups.