摘要
研究了La ,Ce ,Sm及Er对电刷镀Ni P ,Ni Cu P和Ni Cu P MoS2 3种镀层沉积速率的影响。4种稀土都能提高镀层的沉积速率 ,其中Sm对Ni P和Ni Cu P镀层沉积速率的提高效果最为明显。稀土提高镀层沉积速率均存在一最佳的加入量。在一定的刷镀电压范围内 ,稀土加速Ni P ,Ni Cu P镀层沉积速率的作用效果及程度没有变化。分析了稀土提高镀层沉积速率的作用机制。
The effect of four kinds of rare earth elements on the depositing rate of Ni alloy brush plating layers was investigated. All of the rare earth elements increase the depositing rate of Ni alloy brush plating. The greatest depositing rates are achieved at a suitable addition amount of the rare earth elements in the plating solutions. In a certain range of the plating voltage, the efficiency of RE elements to increase the depositing rate of Ni P and Ni Cu P plating is unchanged.
出处
《中国稀土学报》
CAS
CSCD
北大核心
2000年第1期59-62,共4页
Journal of the Chinese Society of Rare Earths
基金
国家博士点基金