水溶性纳米铜的制备及其摩擦学性能研究

Preparation of Water-soluble Copper Nanoparticles and Evaluation of Their Tribological Properties

以氨基功能化羟基硅酸镁为修饰剂,采用原位表面修饰方法制备了水溶性Cu纳米微粒.利用透射电子显微镜观察了水溶性Cu纳米微粒的形貌,利用导热系数测定仪测定了水溶性纳米Cu分散液的导热系数,并通过SRV往复摩擦磨损试验机(球-盘接触方式)考察了水溶性Cu纳米微粒作为水基添加剂的摩擦学性能.结果表明:水溶性纳米Cu微粒作为水基添加剂能够显著减小钢-钢摩擦副的摩擦系数和磨损率,提高纯水的承载能力;在合适的浓度下,水溶性纳米Cu微粒可使纯水导热系数提高近10%.

Water soluble Cu nanoparticles are synthesized by in situ surface modification with NH2 -functionalized magnesium silicate hydroxide and characterized. The morphology of as prepared Cu nanopartieles is observed on a transmission electron microscope. The conductivity coefficient of the aqueous solution of Cu nanoparticles is measured with a thermal conductivity coefficient surveying instrument. An Optimol SRV IV （ball- on- block） oscillating friction and wear tester and is performed to evaluate the tribological properties of Cu nanopartieles in water. Results indicate that as - prepared Cu nanoparticles have good friction - reducing and anti - wear properties for steel - steel frictional pair. In the meantime, as - prepared Cu nanoparticles can reduce the conductivity coefficient of pure water by nearly 10%, which is beneficial for as - prepared Cu nanoparticles to function as a kind of water - based lubricating additives.