摘要
在研究晶圆划片机划切工艺的基础上,分析了划切的质量缺陷和划切质量评估矩阵,阐述了影响划切质量的诸多因素。介绍了划片刀、承载薄膜、划切模式、划切冷却水的添加剂和划切参数的选择对划切质量的影响,通过对以上5个方面的优化来达到优化工艺的目的,同时还提出了将砂轮划片和微水导激光划片相结合的新划切工艺。
This paper aims to study wafer dicing process of dicing saw,analyzes the quality defects and dicing quality evaluation matrix,described the many factors that affect the quality of dicing,such as dicing blade,mounting tape,dicing mode,cooling water additive and the selection of dicing parameters,the quality of the optimization of the above five aspects to optimize the process,meanwhile proposed a new dicing process of combination dicing saw and micro-water guided laser dicing.
出处
《电子工业专用设备》
2012年第4期7-12,共6页
Equipment for Electronic Products Manufacturing
关键词
晶圆
划切设备
工艺
优化
Wafer
Dicing Machine
Technics
Optimization
